公开(公告)号：US11870482B2

公开(公告)日：2024-01-09

申请号：US17515655

申请日：2021-11-01

Applicant: ASUSTeK COMPUTER INC.

Inventor： Wei-Shao Su ,  Chi-Hsien Chiu

IPC: H04B1/40 ,  H04B1/713 ,  H04B1/3805 ,  H04B1/7136

CPC classification number: H04B1/40 ,  H04B1/3805 ,  H04B1/713 ,  H04B2001/71362

Abstract: A wireless transceiver for pairing and connecting to a plurality of wireless devices is provided. The wireless transceiver includes an antenna module, a power divider, and a plurality of RF chips. The antenna module is communicated to the wireless device. The power divider is electrically connected to the power divider, the RF chips are individually paired with one of the wireless devices, and each one of the RF chips and its paired wireless device have at least one same frequency channel, a wireless signal corresponding to the wireless device is sent and received through the power divider and the antenna module after the radio frequency (RF) chip and the wireless device are successfully paired.

公开(公告)号：US20220149884A1

公开(公告)日：2022-05-12

申请号：US17515655

申请日：2021-11-01

Applicant: ASUSTeK COMPUTER INC.

Inventor： Wei-Shao Su ,  Chi-Hsien Chiu

IPC: H04B1/40 ,  H04B1/3805 ,  H04B1/713

Abstract: A wireless transceiver for pairing and connecting to a plurality of wireless devices is provided. The wireless transceiver includes an antenna module, a power divider, and a plurality of RF chips. The antenna module is communicated to the wireless device. The power divider is electrically connected to the power divider, the RF chips are individually paired with one of the wireless devices, and each one of the RF chips and its paired wireless device have at least one same frequency channel, a wireless signal corresponding to the wireless device is sent and received through the power divider and the antenna module after the radio frequency (RF) chip and the wireless device are successfully paired.