公开(公告)号：US20150009074A1

公开(公告)日：2015-01-08

申请号：US14294163

申请日：2014-06-03

Applicant: ASUSTeK COMPUTER INC.

Inventor： Wang-Ta HSIEH ,  Chuan-Chien HUANG ,  Kuei-Shun YEH ,  Wei-Hsin SHIH ,  Chih-Chan LIANG

IPC: H01Q9/04

CPC classification number: H01Q9/0421 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/521 ,  H01Q5/371 ,  H01Q21/30

Abstract: An electronic device includes a conducting element, a supporting element, and a multiband antenna is disclosed. The conducting element is connected to the ground of the electronic device by a high impedance connection. The supporting element has a supporting surface, and the supporting surface and the conducting element are perpendicular. The multiband antenna is disposed at the supporting surface and includes a radiating element, and the radiating element and the conducting element form a coupling capacitor.

Abstract translation: 电子设备包括导电元件，支撑元件和多频带天线。 导电元件通过高阻抗连接连接到电子设备的地面。 支撑元件具有支撑表面，支撑表面和导电元件垂直。 多频带天线设置在支撑面上并且包括辐射元件，辐射元件和导电元件形成耦合电容器。