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公开(公告)号：US20210064176A1
公开(公告)日：2021-03-04
申请号：US16993388
申请日：2020-08-14
Applicant: ASUSTeK COMPUTER INC.
Inventor： Ching-Fu Hsu , Wei-Ting Wong , Chun-Wei Li , Hung-Yi Lin
Abstract: An electronic device and its force touch assembly are provided. The force touch assembly includes a first substrate, a second substrate, a first patterned conductive layer, an insulation layer, a second patterned conductive layer, a plurality of variable pressure sensitive materials and a third patterned conductive layer, wherein the first patterned conductive layer, the insulation layer, the second patterned conductive layer, the plurality of variable pressure sensitive materials and the third patterned conductive layer are sequentially stacked from top to bottom between the first substrate and the second substrate.
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公开(公告)号：US11435844B2
公开(公告)日：2022-09-06
申请号：US16993388
申请日：2020-08-14
Applicant: ASUSTeK COMPUTER INC.
Inventor： Ching-Fu Hsu , Wei-Ting Wong , Chun-Wei Li , Hung-Yi Lin
Abstract: An electronic device and its force touch assembly are provided. The force touch assembly includes a first substrate, a second substrate, a first patterned conductive layer, an insulation layer, a second patterned conductive layer, a plurality of variable pressure sensitive materials and a third patterned conductive layer, wherein the first patterned conductive layer, the insulation layer, the second patterned conductive layer, the plurality of variable pressure sensitive materials and the third patterned conductive layer are sequentially stacked from top to bottom between the first substrate and the second substrate.
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