公开(公告)号：US20250133649A1

公开(公告)日：2025-04-24

申请号：US18531714

申请日：2023-12-07

Applicant: ASUSTeK COMPUTER INC.

Inventor： Kuan-Chuan Wang ,  Yi-Hong Lin ,  Chin-Chuan Wu ,  Wei-Chia Liao

IPC: H05K1/02 ,  H05K7/20

Abstract: A heat dissipation module is adapted for being installed on a circuit board. The heat dissipation module includes a fixed base and a heat dissipating device. One end of the fixed base is adapted for being fixed to the circuit board, and the other end has a rotating component. The rotating component is pivoted on the fixed base along a rotation axis. The heat dissipation device includes a heat dissipation body and an alignment member extending from the heat dissipation body, and the alignment member is adapted to be detachably connected to the rotating component. When the heat dissipation device is connected to the rotating component through the alignment member, the heat dissipation body is adapted to flip relative to the fixed base along the rotating axis.