公开(公告)号：US20030231477A1

公开(公告)日：2003-12-18

申请号：US10409024

申请日：2003-04-08

Applicant: AVX Corporation

Inventor： William F. Vierow ,  Dehart G. Scrantom III ,  Walter Koda ,  Victor Martinez

IPC: H05K007/14 ,  H05K007/18

CPC classification number: H01G4/38

Abstract: Integrated passive component assemblies utilize array shell or array frame receiving structures to isolate and protect discrete passive components and provide a modular configuration for mounting to a substrate. Receiving structure embodiments include a base portion, spacer ribs, and optional side walls. Spacer ribs may be connected or provided in opposing spacer rib portions to effectively isolate adjacent component terminations. Standoff features may be incorporated into select embodiments of the disclosed technology to aid in device mounting and to facilitate post-affixment cleaning and visual termination contact. Discrete passive components in accordance with the present subject matter may include select combinations of resistors, capacitors, inductors, and other suitable devices.

Abstract translation: 集成的无源元件组件利用阵列外壳或阵列框架接收结构来隔离和保护分立的无源元件，并提供用于安装到基板的模块化配置。 接收结构实施例包括基部，间隔肋和可选的侧壁。 间隔肋可以连接或设置在相对的间隔肋部分中以有效地隔离相邻的部件终端。 间隔特征可以被结合到所公开技术的选择实施例中，以帮助装置安装并且便于后固定清洁和视觉终止接触。 根据本主题的分立无源部件可以包括电阻器，电容器，电感器和其它合适的器件的选择组合。