公开(公告)号：US10123437B2

公开(公告)日：2018-11-06

申请号：US15218358

申请日：2016-07-25

申请人： Acer Incorporated

发明人： Sheng Wen Wu ,  Yu-Cheng Huang ,  Ke-Hua Lin ,  Shao-Chi Chuang ,  Wen-Shu Lee

IPC分类号： H05K5/02 ,  H05K5/00

摘要： An electronic device is provided, including a housing, a channel, and a flexible circuit. The housing includes a frame and a buffer structure connected to the frame by overmolding, wherein the hardness of the frame exceeds that of the buffer structure. The channel is extended along a sidewall of the frame, through the housing and adjacent to the buffer structure. The flexible circuit is disposed through the channel to connect a first circuit unit and a second circuit unit of the electronic device.