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公开(公告)号：US11014806B2
公开(公告)日：2021-05-25
申请号：US15599377
申请日：2017-05-18
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Hsu-Liang Hsiao , Lu-Ming Lai , Ching-Han Huang , Chia-Hung Shen
Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate with a first groove and a semiconductor device. The first groove has a first portion, a second portion, and a third portion, and the second portion is between the first portion and the third portion. The semiconductor device includes a membrane and is disposed on the second portion of the first groove. The semiconductor device has a first surface adjacent to the substrate and opposite to the membrane. The membrane is exposed by the first surface.
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公开(公告)号：US12168605B2
公开(公告)日：2024-12-17
申请号：US17330245
申请日：2021-05-25
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Hsu-Liang Hsiao , Lu-Ming Lai , Ching-Han Huang , Chia-Hung Shen
Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate with a first groove and a semiconductor device. The first groove has a first portion, a second portion, and a third portion, and the second portion is between the first portion and the third portion. The semiconductor device includes a membrane and is disposed on the second portion of the first groove. The semiconductor device has a first surface adjacent to the substrate and opposite to the membrane. The membrane is exposed by the first surface.
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