公开(公告)号：US20190295914A1

公开(公告)日：2019-09-26

申请号：US15934582

申请日：2018-03-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yung-Hsing CHANG ,  Chun-Hsiung CHEN ,  Yung-Chi CHEN

IPC: H01L23/31 ,  B81B7/00 ,  H01L23/00 ,  H01L23/29 ,  H01L21/56 ,  B81C1/00

Abstract: A semiconductor device package includes a carrier, a first semiconductor device disposed on the carrier, a second semiconductor device disposed on the first semiconductor device, a conductive wire electrically connecting the first semiconductor device to the carrier, and an encapsulant encapsulating the first semiconductor device, the second semiconductor device and the conductive wire. The second semiconductor device defines a hole. The encapsulant exposes the hole. An apex of the conductive wire is lower than a surface of the second semiconductor device by a first distance (s). The apex of the conductive wire is spaced from the first surface of the encapsulant by a second distance (t). A first surface of the encapsulant is lower than a surface of the second semiconductor device by a third distance (D). The third distance is less than or equal to a difference between the first distance and the second distance.