公开(公告)号：US20240154642A1

公开(公告)日：2024-05-09

申请号：US18414372

申请日：2024-01-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Wen LU ,  Chun-Jen CHEN ,  Po-Hsiang TSENG ,  Hsin-Han LIN ,  Ming-Lun YU

IPC: H04B1/525 ,  H04B1/04 ,  H04B1/10 ,  H04B1/48

CPC classification number: H04B1/525 ,  H04B1/0475 ,  H04B1/1009 ,  H04B1/48 ,  H04B2001/485

Abstract: The present disclosure provides an electronic module including a circuit including a transmitting part and a receiving part physically separated from the transmitting part. The electronic module also includes an element isolated from the circuit and configured to block electrical interference between the transmitting part and the receiving part.

公开(公告)号：US20210257311A1

公开(公告)日：2021-08-19

申请号：US16791946

申请日：2020-02-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hao-Chih HSIEH ,  Tzu-Cheng LIN ,  Chun-Jen CHEN

IPC: H01L23/552 ,  H01L23/538 ,  H01L23/48

Abstract: A semiconductor device package includes a first substrate, a second substrate, a first electronic component, a second electronic component and a shielding layer. The second substrate is disposed over the first substrate. The first electronic component is disposed between the first substrate and the second substrate. The second electronic component is disposed between the first substrate and the second substrate and adjacent to the second substrate than the first electronic component. The shielding element electrically connects the second electronic component to the second substrate. The second electronic component and the shielding element define a space accommodating the first electronic component.

公开(公告)号：US20230057327A1

公开(公告)日：2023-02-23

申请号：US17407067

申请日：2021-08-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Wen LU ,  Chun-Jen CHEN ,  Po-Hsiang TSENG ,  Hsin-Han LIN ,  Ming-Lun YU

IPC: H04B1/525 ,  H04B1/04 ,  H04B1/10 ,  H04B1/48

Abstract: The present disclosure provides an electronic module including a circuit including a transmitting part and a receiving part physically separated from the transmitting part. The electronic module also includes an element isolated from the circuit and configured to block electrical interference between the transmitting part and the receiving part.

公开(公告)号：US20220238457A1

公开(公告)日：2022-07-28

申请号：US17719281

申请日：2022-04-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hao-Chih HSIEH ,  Tzu-Cheng LIN ,  Chun-Jen CHEN

IPC: H01L23/552 ,  H01L23/48 ,  H01L23/538

Abstract: A semiconductor device package includes a first substrate, a second substrate, a first electronic component, a second electronic component and a shielding layer. The second substrate is disposed over the first substrate. The first electronic component is disposed between the first substrate and the second substrate. The second electronic component is disposed between the first substrate and the second substrate and adjacent to the second substrate than the first electronic component. The shielding element electrically connects the second electronic component to the second substrate. The second electronic component and the shielding element define a space accommodating the first electronic component.