公开(公告)号：US10854553B1

公开(公告)日：2020-12-01

申请号：US16424228

申请日：2019-05-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shun-Tsat Tu ,  Chunku Kuo ,  Ya-Tian Hou ,  Tsung-Chieh Kuo

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor package structure includes a substrate having a patterned surface, the patterned surface including a first region and a second region, wherein a first line width in the first region is smaller than a second line width in the second region. The semiconductor package structure further includes a first die hybrid-bonded to the first region through conductive features adapted for the first line width, and a second die bonded to the second region through conductive features adapted for the second line width. The manufacturing operations of the semiconductor package structure are also disclosed.