公开(公告)号：US11289433B2

公开(公告)日：2022-03-29

申请号：US16740168

申请日：2020-01-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng Tseng ,  I Hung Wu

IPC: H01L23/66 ,  H01L23/053 ,  H01L23/498 ,  H01L23/552 ,  H01L23/00 ,  H01L21/48 ,  H01Q1/22

Abstract: A semiconductor package structure includes a carrier, an antenna element, an electronic component, and a conductive structure. The antenna element, which includes an exposed portion, is disposed on the carrier. The conductive structure is disposed between the carrier and the exposed portion of the antenna element. The conductive structure electrically connects the electronic component to the carrier. The carrier, the exposed portion of the antenna element, and the conductive structure define an air space to accommodate the electronic component and to space the electronic component apart from the conductive structure.