公开(公告)号：US20200212005A1

公开(公告)日：2020-07-02

申请号：US16232935

申请日：2018-12-26

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsu-Nan FANG ,  Jen-Hsien WONG

IPC: H01L25/065 ,  H01L23/498 ,  H01L23/31 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor package device includes a circuit layer, a first set of stacked components, a first conductive wire, a space and an electronic component. The first set of stacked components is disposed on the circuit layer. The first conductive wire electrically connects the first set of stacked components. The space is defined between the first set of stacked components and the circuit layer. The space accommodates the first conductive wire. The electronic component is disposed in the space.