公开(公告)号：US20220367308A1

公开(公告)日：2022-11-17

申请号：US17876468

申请日：2022-07-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tun-Ching PI ,  Yen-Chi HUANG ,  Hao-Chih HSIEH ,  Jin Han SHIH

IPC: H01L23/31 ,  H01L21/56 ,  H05K1/18

Abstract: A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space.

公开(公告)号：US20200083132A1

公开(公告)日：2020-03-12

申请号：US16409665

申请日：2019-05-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yen-Chi HUANG ,  Hao-Chih HSIEH ,  Jin Han SHIH ,  Yung I. YEH ,  Tun-Ching PI

IPC: H01L23/31 ,  H01L21/56 ,  H05K1/18

Abstract: A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space.