公开(公告)号：US20230187367A1

公开(公告)日：2023-06-15

申请号：US17548328

申请日：2021-12-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Jen WANG ,  Po-Jen CHENG ,  Fu-Yuan CHEN ,  Kao Hsin CHEN

IPC: H01L23/538 ,  H01L23/00

CPC classification number: H01L23/5386 ,  H01L23/5384 ,  H01L24/14

Abstract: An electronic package structure includes a lower circuit pattern structure, an upper circuit pattern structure, a reflowable material and at least one core element. The upper circuit pattern structure is disposed above the lower circuit pattern structure. The reflowable material is disposed between the upper circuit pattern structure and the lower circuit pattern structure. The core element attaches to the reflowable material and is configured to inhibit displacement of the at least one core element during a reflow process.