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公开(公告)号：US20220181277A1
公开(公告)日：2022-06-09
申请号：US17112930
申请日：2020-12-04
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Ming-Wei HSIEH , Ming-Tau HUANG , Yu-Chih LEE
Abstract: The present disclosure provides a semiconductor a semiconductor device package includes a substrate, an electronic component disposed on the substrate, a package body disposed on the substrate and encapsulating the electronic component, and a capacitor disposed above the electronic component. The capacitor is exposed from the package body.
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