公开(公告)号：US20220068840A1

公开(公告)日：2022-03-03

申请号：US17006672

申请日：2020-08-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Po-Jen CHENG ,  Po-Hsiang WANG ,  Fu-Yuan CHEN ,  Wei-Jen WANG

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device package and manufacturing method thereof are provided. The semiconductor device package includes a first conductive structure, a second conductive structure, a connection element, a conductive member, an encapsulant and a binding layer. The first conductive structure includes a first circuit layer. The second conductive structure is disposed over the first conductive structure. The connection element is disposed on and electrically connected to the first circuit layer. The conductive member protrudes from the second conductive structure. The encapsulant is disposed between the first conductive structure and the second conductive structure. The binding layer is disposed between the second conductive structure and the encapsulant.