公开(公告)号：US09977147B2

公开(公告)日：2018-05-22

申请号：US14975036

申请日：2015-12-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ruei-Bin Ma ,  Ying-Chung Chen ,  Lu-Ming Lai

IPC: H01L31/16 ,  H01L25/16 ,  G01V8/12 ,  H01L31/167

CPC classification number: G01V8/12 ,  H01L25/167 ,  H01L31/167 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An optical module includes a carrier, a light-emitting component disposed over the carrier, an optical sensor disposed over the carrier, a housing, and a lens. The housing is disposed over the carrier and encircles the light-emitting component and the optical sensor. The housing defines a first accommodation space including a first aperture and a second aperture below the first aperture. The housing includes a first sidewall surrounding the first aperture, a second sidewall surrounding the second aperture, and a first support portion where a bottom end of the first sidewall and a top end of the second sidewall meet. The lens is located in the first aperture and is supported by the first support portion. One of the light-emitting component or the optical sensor is located in the first accommodation space.