公开(公告)号：US11302646B2

公开(公告)日：2022-04-12

申请号：US16791946

申请日：2020-02-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hao-Chih Hsieh ,  Tzu-Cheng Lin ,  Chun-Jen Chen

IPC: H01L23/552 ,  H01L23/48 ,  H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01L25/07 ,  H01L23/60

Abstract: A semiconductor device package includes a first substrate, a second substrate, a first electronic component, a second electronic component and a shielding layer. The second substrate is disposed over the first substrate. The first electronic component is disposed between the first substrate and the second substrate. The second electronic component is disposed between the first substrate and the second substrate and adjacent to the second substrate than the first electronic component. The shielding element electrically connects the second electronic component to the second substrate. The second electronic component and the shielding element define a space accommodating the first electronic component.

公开(公告)号：US12176297B2

公开(公告)日：2024-12-24

申请号：US17719281

申请日：2022-04-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hao-Chih Hsieh ,  Tzu-Cheng Lin ,  Chun-Jen Chen

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/48 ,  H01L23/538 ,  H01L25/065

Abstract: A semiconductor device package includes a first substrate, a second substrate, a first electronic component, a second electronic component and a shielding layer. The second substrate is disposed over the first substrate. The first electronic component is disposed between the first substrate and the second substrate. The second electronic component is disposed between the first substrate and the second substrate and adjacent to the second substrate than the first electronic component. The shielding element electrically connects the second electronic component to the second substrate. The second electronic component and the shielding element define a space accommodating the first electronic component.