-
公开(公告)号：US20220328446A1
公开(公告)日：2022-10-13
申请号：US17225828
申请日：2021-04-08
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Chih-Cheng HUNG , Wei-Han LAI
IPC: H01L23/00
Abstract: A bonding device for bonding an electronic element includes an engaging component. The engaging component has a first surface and a second surface opposite to the first surface. The engaging component includes a plurality of recesses at the second surface. The plurality of recesses are configured to cover a plurality of projections of an electronic element. The engaging component is coupled to a heating component.
Search Results
1
records
(took 0.011 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
