公开(公告)号：US12266610B2

公开(公告)日：2025-04-01

申请号：US17942984

申请日：2022-09-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yencheng Kuo ,  Shao-Lun Yang

IPC: H01L23/538 ,  B81B7/00 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L25/16

Abstract: A semiconductor package device and a method of manufacturing a semiconductor package device are provided. The semiconductor package device includes a substrate, a first electronic component, a first dielectric layer, and a first hole. The substrate has a first surface and a second surface opposite to the first surface. The first electronic component is disposed on the first surface. The first dielectric layer is disposed on the second surface and has a third surface away from the substrate. The first hole extends from the first dielectric layer and the substrate. The first hole is substantially aligned with the first electronic component.

公开(公告)号：US11444032B2

公开(公告)日：2022-09-13

申请号：US16917335

申请日：2020-06-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yencheng Kuo ,  Shao-Lun Yang

IPC: H01L23/538 ,  H01L23/00 ,  H01L21/48 ,  H01L23/498 ,  B81B7/00 ,  H01L25/16

Abstract: A semiconductor package device and a method of manufacturing a semiconductor package device are provided. The semiconductor package device includes a substrate, a first electronic component, a first dielectric layer, and a first hole. The substrate has a first surface and a second surface opposite to the first surface. The first electronic component is disposed on the first surface. The first dielectric layer is disposed on the second surface and has a third surface away from the substrate. The first hole extends from the first dielectric layer and the substrate. The first hole is substantially aligned with the first electronic component.