公开(公告)号：US20230124000A1

公开(公告)日：2023-04-20

申请号：US17501953

申请日：2021-10-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Jen WANG ,  Po-Jen CHENG ,  Fu-Yuan CHEN ,  Yi-Hsin CHENG

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/538

Abstract: At least some embodiments of the present disclosure relate to an electronic package structure. The electronic package structure includes an electronic structure, a wiring structure disposed over the electronic structure, a bonding element connecting the wiring structure and the electronic structure, and a reinforcement element attached to the wiring structure. An elevation difference between a highest point and a lowest point of a surface of the wiring structure facing the electronic structure is less than a height of the bonding element.