公开(公告)号：US11174157B2

公开(公告)日：2021-11-16

申请号：US16452370

申请日：2019-06-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng Tseng ,  Lu-Ming Lai ,  Yu-Hsuan Tsai ,  Yin-Hao Chen ,  Hsin Lin Wu ,  San-Kuei Yu

IPC: B81C1/00 ,  H01L23/498 ,  H01L23/00 ,  B81B7/00

Abstract: A semiconductor device package includes a semiconductor device, a non-semiconductor substrate over the semiconductor device, and a first connection element extending from the semiconductor device to the non-semiconductor substrate and electrically connecting the semiconductor device to the non-semiconductor substrate.