公开(公告)号：US10790323B2

公开(公告)日：2020-09-29

申请号：US16287970

申请日：2019-02-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Min Peng

IPC: H01L27/146 ,  G06K9/00

Abstract: A semiconductor device package includes a semiconductor device, an optical conductive pillar, a first encapsulant and a second encapsulant. The semiconductor device includes a pixel. The optical conductive pillar is disposed on the pixel. The first encapsulant has a first thickness and encapsulates the optical conductive pillar. The second encapsulant has a second thickness different from the first thickness.

公开(公告)号：US10782184B2

公开(公告)日：2020-09-22

申请号：US15687090

申请日：2017-08-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Min Peng ,  Ching-Han Huang ,  Lu-Ming Lai

IPC: G01J1/04

Abstract: The present disclosure relates to an optical device. The optical device comprises an electronic component, a plurality of light conducting pillars and an opaque layer. The electronic component includes a plurality of pixels. Each of the light conducting pillars is disposed over a corresponding pixel of the plurality of pixels of the electronic component. The opaque layer covers a lateral surface of each of the light conducting pillars.