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公开(公告)号：US20180290882A1
公开(公告)日：2018-10-11
申请号：US15574349
申请日：2016-06-10
Applicant: Agency for Science, Technology and Research
Inventor： Daniel Minwoo Rhee , Peter Hyun Kee Chang
Abstract: According to various embodiments, there is provided a method for fabricating a semiconductor package, the method including forming a cap structure and a pillar from a first wafer; bonding the first wafer to a second wafer; and filling a gap between the pillar and the cap structure with a mold compound.
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