Patterned wafer defect inspection system and method

    公开(公告)号:US08401272B2

    公开(公告)日:2013-03-19

    申请号:US11888827

    申请日:2007-08-02

    CPC classification number: G01N21/95607 G01N21/9501

    Abstract: A system for inspecting semiconductor devices is provided. The system includes a region system selecting a plurality of regions from a semiconductor wafer. A golden template system generates a region golden template for each region, such as to allow a die image to be compared to golden templates from a plurality of regions. A group golden template system generates a plurality of group golden templates from the region golden templates, such as to allow the die image to be compared to golden templates from a plurality of group golden templates.

    Patterned wafer defect inspection system and method
    2.
    发明申请
    Patterned wafer defect inspection system and method 有权
    图案化晶圆缺陷检测系统及方法

    公开(公告)号:US20090034831A1

    公开(公告)日:2009-02-05

    申请号:US11888827

    申请日:2007-08-02

    CPC classification number: G01N21/95607 G01N21/9501

    Abstract: A system for inspecting semiconductor devices is provided. The system includes a region system selecting a plurality of regions from a semiconductor wafer. A golden template system generates a region golden template for each region, such as to allow a die image to be compared to golden templates from a plurality of regions. A group golden template system generates a plurality of group golden templates from the region golden templates, such as to allow the die image to be compared to golden templates from a plurality of group golden templates.

    Abstract translation: 提供了一种用于检查半导体器件的系统。 该系统包括从半导体晶片选择多个区域的区域系统。 金色模板系统为每个区域生成区域金色模板,以允许将模具图像与来自多个区域的金色模板进行比较。 组金模板系统从区域金模板生成多个组黄金模板,以允许将模具图像与来自多个组金模板的金模板进行比较。

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