Vacuum Processing Apparatus
    2.
    发明申请
    Vacuum Processing Apparatus 有权
    真空处理设备

    公开(公告)号:US20080317581A1

    公开(公告)日:2008-12-25

    申请号:US12199876

    申请日:2008-08-28

    IPC分类号: H01L21/203

    摘要: A vacuum processing apparatus includes an outer chamber comprising a vacuum container, an inner chamber in which a plasma used for processing a wafer is generated, the inner chamber being detachably disposed inside of the outer chamber, a wafer holder on which the wafer is located is disposed inside of the inner chamber, and an exhausting device disposed below the wafer holder which exhausts the inside of the inner chamber. The inner chamber is sealed in air-tight manner with respect to a space between the inner chamber and the outer chamber while the space is maintained at a vacuum pressure.

    摘要翻译: 一种真空处理装置,其特征在于,包括真空容器的外部室,产生用于处理晶片的等离子体的内部室,可拆卸地设置在所述外部室内部的内室,所述晶片所在的晶片保持架为 并且设置在所述晶片保持器的下方排出所述内室的内部的排气装置。 相对于内室和外室之间的空间,内室以气密方式密封,同时空间保持在真空压力。