公开(公告)号：US20090052142A1

公开(公告)日：2009-02-26

申请号：US11844995

申请日：2007-08-24

申请人： Alberto Brewer ,  Clint Wilber ,  Todd Conklin ,  Robert Hertlein

发明人： Alberto Brewer ,  Clint Wilber ,  Todd Conklin ,  Robert Hertlein

IPC分类号： H05K7/20 ,  H05K7/14 ,  H05K1/14 ,  H05K3/00 ,  H04L5/16

CPC分类号： H05K1/144 ,  H05K1/0203 ,  H05K5/0278 ,  H05K2201/042 ,  H05K2201/10371 ,  Y10T29/49124

摘要： An electronic device includes a first printed circuit board including electronic components, a second printed circuit board including electronic components, and a shielding midframe. The shielding midframe is adapted to provide electromagnetic isolation between the first printed circuit board and the second printed circuit board. The shielding midframe is further adapted to provide electromagnetic isolation of electronic components on at least one of the first printed circuit or the second printed circuit.

摘要翻译： 电子设备包括包括电子部件的第一印刷电路板，包括电子部件的第二印刷电路板和屏蔽中框。 屏蔽中框架适于在第一印刷电路板和第二印刷电路板之间提供电磁隔离。 屏蔽中框架还适于在第一印刷电路或第二印刷电路中的至少一个上提供电子元件的电磁隔离。

公开(公告)号：US08018734B2

公开(公告)日：2011-09-13

申请号：US11844995

申请日：2007-08-24

申请人： Alberto Brewer ,  Clint Wilber ,  Todd Conklin ,  Robert Hertlein

发明人： Alberto Brewer ,  Clint Wilber ,  Todd Conklin ,  Robert Hertlein

IPC分类号： H05K7/14 ,  H05K7/18

CPC分类号： H05K1/144 ,  H05K1/0203 ,  H05K5/0278 ,  H05K2201/042 ,  H05K2201/10371 ,  Y10T29/49124

摘要： An electronic device includes a first printed circuit board including electronic components, a second printed circuit board including electronic components, and a shielding midframe. The shielding midframe is adapted to provide electromagnetic isolation between the first printed circuit board and the second printed circuit board. The shielding midframe is further adapted to provide electromagnetic isolation of electronic components on at least one of the first printed circuit or the second printed circuit.

摘要翻译： 电子设备包括包括电子部件的第一印刷电路板，包括电子部件的第二印刷电路板和屏蔽中框。 屏蔽中框架适于在第一印刷电路板和第二印刷电路板之间提供电磁隔离。 屏蔽中框还适于在第一印刷电路或第二印刷电路中的至少一个上提供电子元件的电磁隔离。