Method and system for reducing semiconductor wafer breakage
    1.
    发明授权
    Method and system for reducing semiconductor wafer breakage 有权
    减少半导体晶片破损的方法和系统

    公开(公告)号:US06934595B1

    公开(公告)日:2005-08-23

    申请号:US10375318

    申请日:2003-02-26

    CPC classification number: H01L21/67259

    Abstract: In a system and method to reduce wafer breakages in a wafer handling system, the position of a wafer on a platen is monitored and closing of the platen on a vacuum chamber is prevented if a misaligned wafer is detected. In one embodiment the wafer position is monitored by monitoring the air pressure in vacuum channels of a platen faceplate.

    Abstract translation: 在减小晶片处理系统中的晶片破损的系统和方法中,如果检测到未对准的晶片,则监测晶片在压板上的位置,并且防止压板在真空室上的闭合。 在一个实施例中,通过监视压板面板的真空通道中的空气压力来监视晶片位置。

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