Metal/ceramic composite molding material
    1.
    发明申请
    Metal/ceramic composite molding material 审中-公开
    金属/陶瓷复合成型材料

    公开(公告)号:US20020006988A1

    公开(公告)日:2002-01-17

    申请号:US09898198

    申请日:2001-07-03

    Abstract: A composite molding compound comprising a combination of metal and ceramic powders is disclosed. The powders are combined with a binder, a liquid carrier and other processing additives in a manner to provide uniform distribution of two phases in a material format that facilitates the molding of complex parts at relatively low pressures and temperatures using conventional injection molding machines. The products formed from these molding compounds may be designed with tailored physical and mechanical properties such as thermal conductivity, thermal expansion coefficient, density, elastic modulus and wear properties.

    Abstract translation: 公开了包含金属和陶瓷粉末的组合的复合模塑料。 粉末与粘合剂,液体载体和其它加工添加剂结合,以便以使用常规注射成型机在相对低的压力和温度下成型复合部件的材料形式均匀分布两相。 由这些模塑料形成的产品可以设计成具有定制的物理和机械性能,例如导热性,热膨胀系数,密度,弹性模量和磨损性能。

    METAL/CERAMIC COMPOSITE MOLDING MATERIAL
    2.
    发明申请
    METAL/CERAMIC COMPOSITE MOLDING MATERIAL 失效
    金属/陶瓷复合材料

    公开(公告)号:US20030125426A1

    公开(公告)日:2003-07-03

    申请号:US09898111

    申请日:2001-07-01

    Abstract: A composite molding compound comprising a combination of metal and ceramic powders is disclosed. The powders are combined with a binder, a liquid carrier and other processing additives in a manner to provide uniform distribution of two phases in a material format that facilitates the molding of complex parts at relatively low pressures and temperatures using conventional injection molding machines. The products formed from these molding compounds may be designed with tailored physical and mechanical properties such as thermal conductivity, thermal expansion coefficient, density, elastic modulus and wear properties.

    Abstract translation: 公开了包含金属和陶瓷粉末的组合的复合模塑料。 粉末与粘合剂,液体载体和其它加工添加剂结合,以便以使用常规注射成型机在相对低的压力和温度下成型复合部件的材料形式均匀分布两相。 由这些模塑料形成的产品可以设计成具有定制的物理和机械性能,例如导热性,热膨胀系数,密度,弹性模量和磨损性能。

Patent Agency Ranking