公开(公告)号：US20220064466A1

公开(公告)日：2022-03-03

申请号：US17524891

申请日：2021-11-12

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  Jayaprakash SUNDARAMURTHY ,  Siuli SARKAR ,  Ravindra M. BHATKAL

IPC: C09D11/322 ,  B41F15/40 ,  B41M5/00 ,  C09D11/037 ,  C09D11/101 ,  C09D11/102 ,  C09D11/104 ,  C09D11/107 ,  C09D11/38 ,  H05K1/03 ,  H05K3/00

Abstract: The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuity and devices.