公开(公告)号：US11002496B2

公开(公告)日：2021-05-11

申请号：US16355120

申请日：2019-03-15

Applicant: Alstom Transport Technologies

Inventor： Adrien Zanetti ,  Damien Blanchet ,  Gaetan Tuyeras ,  Julien Ravot

IPC: F28F13/00 ,  H05K7/20 ,  H01L23/433

Abstract: This thermal conduction device intended to be installed between a first heat source part and a second heat dissipation part, comprises a male element comprising a protruding part relative to a base and a female element comprising an inner wall defining a housing for receiving the protruding part. The male element is configured to exert a radial force against the inner wall when the thermal conduction device is installed between the first heat source part and the second heat dissipation part so as to improve the thermal conduction between the male element and the female element.

公开(公告)号：US20190285371A1

公开(公告)日：2019-09-19

申请号：US16355120

申请日：2019-03-15

Applicant: Alstom Transport Technologies

Inventor： Adrien Zanetti ,  Damien Blanchet ,  Gaetan Tuyeras ,  Julien Ravot

IPC: F28F13/00 ,  H05K7/20

Abstract: This thermal conduction device intended to be installed between a first heat source part and a second heat dissipation part, comprises a male element comprising a protruding part relative to a base and a female element comprising an inner wall defining a housing for receiving the protruding part. The male element is configured to exert a radial force against the inner wall when the thermal conduction device is installed between the first heat source part and the second heat dissipation part so as to improve the thermal conduction between the male element and the female element.