公开(公告)号：US11514906B2

公开(公告)日：2022-11-29

申请号：US16830716

申请日：2020-03-26

Applicant: Amazon Technologies, Inc.

Inventor： Amita Pawar ,  Jordan Pine ,  Albert John Yu Sam Chua ,  Yu-Tsen Kuo ,  Thompson Q. Nguyen

IPC: G10L15/22 ,  F21V7/04 ,  F21V19/00 ,  G04G21/06 ,  H04R1/02 ,  H04R9/02 ,  F21Y115/10 ,  G04G17/08

Abstract: Systems, methods, and computer-readable media are disclosed for voice activated devices with integrated heatsinks and speakers. In one embodiment, an example voice activated device may include a housing having an upper portion and a lower portion, a speaker housing, a heatsink coupled to the speaker housing, where the heatsink and the speaker housing together form a sealed chamber, a first speaker coupled to the speaker housing and partially disposed within the sealed chamber, where the first speaker is oriented to output audio towards the upper portion of the housing, and a light ring disposed about the lower portion of the housing.

公开(公告)号：US20210304744A1

公开(公告)日：2021-09-30

申请号：US16830716

申请日：2020-03-26

Applicant: Amazon Technologies, Inc.

Inventor： Amita Pawar ,  Jordan Pine ,  Albert John Yu Sam Chua ,  Yu-Tsen Kuo ,  Thompson Q. Nguyen

IPC: G10L15/22 ,  H04R1/02 ,  H04R9/02 ,  G04G21/06 ,  F21V7/04 ,  F21V19/00

Abstract: Systems, methods, and computer-readable media are disclosed for voice activated devices with integrated heatsinks and speakers. In one embodiment, an example voice activated device may include a housing having an upper portion and a lower portion, a speaker housing, a heatsink coupled to the speaker housing, where the heatsink and the speaker housing together form a sealed chamber, a first speaker coupled to the speaker housing and partially disposed within the sealed chamber, where the first speaker is oriented to output audio towards the upper portion of the housing, and a light ring disposed about the lower portion of the housing.