公开(公告)号：US10185299B2

公开(公告)日：2019-01-22

申请号：US15124692

申请日：2015-03-11

申请人： Ametek Precitech, Inc.

发明人： Mark McNinch Walter, III ,  Edward Everett Freyenhagen, Jr. ,  Jeffrey William Roblee

IPC分类号： G05B19/27 ,  G05B19/401

摘要： A method and apparatus for treating a circumferential edge of a part are described. The method includes the steps of (1) mapping the circumferential edge of the part with a measuring device, either directly or differentially from a known shape profile; and (2) using the measured data to more accurately follow the circumferential edge of the part during subsequent treatment processing steps, thereby improving the accuracy of the treatment process and compared with a non-mapped treatment process.

公开(公告)号：US20170082999A1

公开(公告)日：2017-03-23

申请号：US15124692

申请日：2015-03-11

申请人： Ametek Precitech, Inc.

发明人： Mark McNinch Walter, III ,  Edward Everett Freyenhagen, JR. ,  Jeffrey William Roblee

IPC分类号： G05B19/27 ,  G05B19/401

CPC分类号： G05B19/27 ,  G05B19/401 ,  G05B2219/37339 ,  G05B2219/37607 ,  G05B2219/45074

摘要： A method and apparatus for treating a circumferential edge of a part are described. The method includes the steps of (1) mapping the circumferential edge of the part with a measuring device, either directly or differentially from a known shape profile; and (2) using the measured data to more accurately follow the circumferential edge of the part during subsequent treatment processing steps, thereby improving the accuracy of the treatment process and compared with a non-mapped treatment process.