公开(公告)号：US10424556B2

公开(公告)日：2019-09-24

申请号：US15236664

申请日：2016-08-15

Applicant: Amkor Technology, Inc.

Inventor： Jong Ok Chun ,  Nozad Karim ,  Richard Chen ,  Giuseppe Selli ,  Michael Kelly

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H05K7/10 ,  H01L23/31 ,  H05K1/02 ,  H05K1/11 ,  H05K1/16

Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.

公开(公告)号：US20160351525A1

公开(公告)日：2016-12-01

申请号：US15236664

申请日：2016-08-15

Applicant: Amkor Technology, Inc.

Inventor： Jong Ok Chun ,  Nozad Karim ,  Richard Chen ,  Giuseppe Selli ,  Michael Kelly

IPC: H01L23/00 ,  H01L23/66 ,  H01L23/31

Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.

Abstract translation: 电子部件封装包括基板和安装到基板的电子部件，电子部件包括接合焊盘。 第一天线端子电连接到接合焊盘，第一天线端子电连接到衬底的第二天线端子。 封装体包围电子部件，封装主体具有主表面。 通过施加导电涂层在主表面上形成天线。 嵌入式互连件在基板和主表面之间延伸穿过封装主体并将第二天线端子电连接到天线。 施加导电涂层以形成天线相对简单，从而使整体封装制造成本最小化。 此外，天线相对较薄，从而使整体封装尺寸最小化。