公开(公告)号：US10950542B2

公开(公告)日：2021-03-16

申请号：US16359450

申请日：2019-03-20

Applicant: Analog Devices, Inc.

Inventor： Luke Steigerwald ,  Marc E. Goldfarb ,  Andrew Pye ,  Simon Gay

IPC: H03F3/187 ,  H01L23/522 ,  H03H7/42 ,  H01L23/64 ,  H03F3/195 ,  H01L23/532 ,  H03G3/30 ,  H01L23/66

Abstract: One embodiment is an apparatus comprising a semiconductor integrated circuit (“IC”) chip comprising at least one active component for implementing an amplifier circuit; and a laminate structure comprising a plurality of metal layers, the laminate structure further comprising a plurality of passive components and transmission line-based structures. The semiconductor IC chip is integrated with the laminate structure such that a top layer of the laminate structure comprises a shield over a top of the semiconductor IC chip and the passive components for limiting electromagnetic coupling of signals generated by the amplifier circuit beyond the laminate structure.

公开(公告)号：US20200303302A1

公开(公告)日：2020-09-24

申请号：US16359450

申请日：2019-03-20

Applicant: Analog Devices, Inc.

Inventor： Luke Steigerwald ,  Marc E. Goldfarb ,  Andrew Pye ,  Simon Gay

IPC: H01L23/522 ,  H03H7/42 ,  H01L23/64 ,  H01L23/66 ,  H01L23/532 ,  H03G3/30 ,  H03F3/195

Abstract: One embodiment is an apparatus comprising a semiconductor integrated circuit (“IC”) chip comprising at least one active component for implementing an amplifier circuit; and a laminate structure comprising a plurality of metal layers, the laminate structure further comprising a plurality of passive components and transmission line-based structures. The semiconductor IC chip is integrated with the laminate structure such that a top layer of the laminate structure comprises a shield over a top of the semiconductor IC chip and the passive components for limiting magnetic coupling of signals generated by the amplifier circuit beyond the laminate structure.