公开(公告)号：US10730743B2

公开(公告)日：2020-08-04

申请号：US16159477

申请日：2018-10-12

申请人： Analog Devices Global Unlimited Company

发明人： Oliver J. Kierse ,  Rigan McGeehan ,  Alfonso Berduque ,  Donal Peter McAuliffe ,  Raymond J. Speer ,  Brendan Cawley ,  Brian J. Coffey ,  Gerald Blaney

IPC分类号： H01L23/02 ,  B81B7/00 ,  G01N33/00 ,  H01L23/00 ,  H01L23/31 ,  G01N27/404 ,  H01L25/065 ,  B81C1/00 ,  H01L23/055 ,  H01L23/24 ,  H01L23/49 ,  H01L23/498 ,  H01L23/50

摘要： A gas sensor package is disclosed. The gas sensor package can include a housing defining a first chamber and a second chamber. An electrolyte can be provided in the first chamber. A gas inlet can provide fluid communication between the second chamber and the outside environs. The gas inlet can be configured to permit gas to enter the second chamber from the outside environs. An integrated device die can be mounted to the housing. The integrated device die can comprise a sensing element configured to detect the gas. The integrated device die can have a first side exposed to the first chamber and a second side exposed to the second chamber, with the first side opposite the second side.

公开(公告)号：US20190135614A1

公开(公告)日：2019-05-09

申请号：US16159477

申请日：2018-10-12

申请人： Analog Devices Global Unlimited Company

发明人： Oliver J. Kierse ,  Rigan McGeehan ,  Alfonso Berduque ,  Donal Peter McAuliffe ,  Raymond J. Speer ,  Brendan Cawley ,  Brian J. Coffey ,  Gerald Blaney

IPC分类号： B81B7/00 ,  B81C1/00 ,  H01L23/055 ,  H01L23/498 ,  H01L23/24 ,  H01L23/49 ,  H01L23/50 ,  H01L23/00 ,  G01N33/00

摘要： A gas sensor package is disclosed. The gas sensor package can include a housing defining a first chamber and a second chamber. An electrolyte can be provided in the first chamber. A gas inlet can provide fluid communication between the second chamber and the outside environs. The gas inlet can be configured to permit gas to enter the second chamber from the outside environs. An integrated device die can be mounted to the housing. The integrated device die can comprise a sensing element configured to detect the gas. The integrated device die can have a first side exposed to the first chamber and a second side exposed to the second chamber, with the first side opposite the second side.