公开(公告)号：US20200091582A1

公开(公告)日：2020-03-19

申请号：US16132786

申请日：2018-09-17

Applicant: Analog Devices Global Unlimited Company

Inventor： Romulo Maggay

IPC: H01Q1/22 ,  H01Q1/38 ,  H01Q9/04 ,  H01L23/66 ,  H01Q1/40 ,  H01Q23/00 ,  H01L23/498

Abstract: System in package (SIP) modules are compact packages that include components such as processors, memory, sensors, and passive components on a single substrate. One low cost and compact way to integrate an antenna into a SIP module is to suspend an antenna in molding compound so that the antenna is embedded in the real estate of the molding compound layer. To embed the antenna, the molding compound is first deposited. A cavity can be cut in the molding compound to hold the antenna. The cavity can be filled with conductive material to form the antenna. Further molding compound can be deposited to cover the antenna and enclose the antenna in the molding compound layer. Ground structures can also be suspended in the molding compound. Such an embedded antenna can be particularly useful for radio applications.