公开(公告)号：US20190295968A1

公开(公告)日：2019-09-26

申请号：US16058922

申请日：2018-08-08

Applicant: Analog Devices Global Unlimited Company

Inventor： Bilge Bayrakci ,  Abdullah Celik ,  Winslow Round ,  Santosh Anil Kudtarkar ,  Yusuf Atesal ,  Turusan Kolcuoglu

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00

Abstract: A package is disclosed. The package includes a carrier that comprises a first conductive layer on a first side and a second conductive layer on a second side opposite the first side. The first conductive layer comprises wire bonding pads. The package also includes a semiconductor die that is flip chip mounted on the first side of the carrier.