专利检索 ap:("Andreas Jakob" OR "Klaus-D. Vissing" OR "Volkmar Stenzel") AND inv:"Klaus-D. Vissing" 第 1 页

1.

发明授权
Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer 有权
标题翻译：除了包括分离层和支撑层的晶片之外，用于加工晶片的方法和装置

公开(公告)号：US07482249B2

公开(公告)日：2009-01-27

申请号：US10536725

申请日：2003-11-28

申请人： Andreas Jakob , Klaus-D. Vissing , Volkmar Stenzel

发明人： Andreas Jakob , Klaus-D. Vissing , Volkmar Stenzel

IPC分类号： H01L21/00

CPC分类号： H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2221/68395

摘要： A process and an apparatus are described for the treatment of wafers, in particular for the thinning of wafers. A wafer with a carrier layer and an interlayer arranged between the carrier layer and the wafer is also described, in which the interlayer is a plasmapolymeric layer that adheres to the wafer and adheres more strongly to the carrier layer than to the wafer.

摘要翻译： 描述了用于处理晶片的工艺和设备，特别是用于晶片的减薄。还描述了具有载体层和布置在载体层和晶片之间的中间层的晶片，其中中间层是粘附到晶片并且比载体层更坚固地粘附到晶片上的等离子体聚合物层。

2.

发明申请
Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer 有权

公开(公告)号：US20060166464A1

公开(公告)日：2006-07-27

申请号：US10536725

申请日：2003-11-28

申请人： Andreas Jakob , Klaus-D. Vissing , Volkmar Stenzel

发明人： Andreas Jakob , Klaus-D. Vissing , Volkmar Stenzel

IPC分类号： H01L21/78 , H01L21/301 , H01L21/46

CPC分类号： H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2221/68395

摘要： A process and an apparatus are described for the treatment of wafers, in particular for the thinning of wafers. A wafer with a carrier layer and an interlayer arranged between the carrier layer and the wafer is also described, in which the interlayer is a plasmapolymeric layer that adheres to the wafer and adheres more strongly to the carrier layer than to the wafer.