公开(公告)号：US07088397B1

公开(公告)日：2006-08-08

申请号：US09715794

申请日：2000-11-16

申请人： Andrew Arthur Hunter ,  James-Yu Chang ,  Park-Kee Yu ,  Ray Schuder

发明人： Andrew Arthur Hunter ,  James-Yu Chang ,  Park-Kee Yu ,  Ray Schuder

IPC分类号： H04N5/225

CPC分类号： H04N5/2253 ,  G02B7/022 ,  H04N5/2254

摘要： A digital image capture system includes an image sensor, a package structure for holding the image sensor, and electrical connectors for creating electrical connections between the image sensor and a circuit board. The package structure includes attachment features that enable an optics system to be securely attached to the package structure after the package structure has been soldered to the circuit board In an embodiment, the attachment features align the optics system with the image sensor without having to power up the image sensor. An embodiment of the attachment features includes mechanical attachment features, such as clip arms and/or clip receivers. In an embodiment, the optics system includes attachment features that are complementary to the attachment features of the package structure. The package structure and optics system may additionally include complementary contact surfaces that create a light-tight connection between the optics system and the package structure.

摘要翻译： 数字图像捕获系统包括图像传感器，用于保持图像传感器的封装结构以及用于在图像传感器和电路板之间建立电连接的电连接器。 封装结构包括附件特征，其使光学系统能够在封装结构被焊接到电路板之后牢固地附接到封装结构。在一个实施例中，附接特征将光学系统与图像传感器对准，而不必上电 图像传感器。 附接特征的实施例包括机械附接特征，例如夹臂和/或夹子接收器。 在一个实施例中，光学系统包括与封装结构的附接特征互补的附接特征。 封装结构和光学系统可以另外包括在光学系统和封装结构之间产生不透光连接的互补接触表面。

公开(公告)号：US06683298B1

公开(公告)日：2004-01-27

申请号：US09717185

申请日：2000-11-20

申请人： Andrew Arthur Hunter ,  Ray Schuder ,  Park-Kee Yu ,  James-Yu Chang

发明人： Andrew Arthur Hunter ,  Ray Schuder ,  Park-Kee Yu ,  James-Yu Chang

IPC分类号： H01J502

CPC分类号： G02B7/022 ,  H01L31/02325 ,  H04N5/2253 ,  H04N5/2254

摘要： A digital image capture system includes an image sensor package and a powered lens element that is attached to the image sensor package. The image sensor package includes an image sensor, a package structure for holding the image sensor, and electrical connectors for creating electrical connection between the image sensor and a circuit board. The package structure and the powered lens element include complementary surfaces that enable the powered lens element to be attached to the image sensor package. Preferably, the powered lens element is glued to the package structure to create a sealed environment for the image sensor. In an embodiment, a temporary protective cover is attached to the powered lens element to protect the powered lens element during attachment of the image sensor package to the circuit board. In an embodiment of the digital image capture system, an additional powered lens element is attached to the powered lens element to create a composite lens element. In an embodiment of the digital image capture system, the powered lens element includes an opaque surface that prevents unwanted light from contacting the image sensor. An advantage of the digital image capture system is that no additional lens mounting structures are required to attach a powered lens element to the image sensor package.

摘要翻译： 数字图像捕获系统包括附接到图像传感器封装的图像传感器封装和动力透镜元件。 图像传感器封装包括图像传感器，用于保持图像传感器的封装结构以及用于在图像传感器和电路板之间形成电连接的电连接器。 封装结构和动力透镜元件包括能够将动力透镜元件附接到图像传感器封装的互补表面。 优选地，动力透镜元件胶合到包装结构以为图像传感器创建密封环境。 在一个实施例中，临时保护盖附接到动力透镜元件，以在将图像传感器封装件附接到电路板期间保护动力透镜元件。 在数字图像捕获系统的一个实施例中，附加的有源透镜元件附接到动力透镜元件以产生复合透镜元件。 在数字图像捕获系统的实施例中，动力透镜元件包括防止不需要的光接触图像传感器的不透明表面。 数字图像捕获系统的优点在于，不需要附加的透镜安装结构来将动力透镜元件附接到图像传感器封装。