公开(公告)号：US3951707A

公开(公告)日：1976-04-20

申请号：US460818

申请日：1974-04-15

申请人： Anthony D. Kurtz ,  Joseph R. Mallon ,  Harold Bernstein ,  Richard Alan Weber

发明人： Anthony D. Kurtz ,  Joseph R. Mallon ,  Harold Bernstein ,  Richard Alan Weber

IPC分类号： G01L9/00 ,  H01L21/58 ,  H01L41/22 ,  C23F1/04

CPC分类号： H01L24/83 ,  G01L9/0042 ,  H01L24/29 ,  H01L41/332 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/351 ,  Y10T29/42

摘要： A glass or other dielectric backed transducer structure is formed by utilizing a series of processes including at least one electrostatic bond. The processes enable one to bond a semiconductor wafer to a dielectric as a glass wafer. Then by selectively removing certain conductively semiconductor, one obtains a "thin ribbon" piezoresistive bridge secured to a thin glass wafer. The resultant structure is entirely unanticipated by the prior art.A glass part is also formed by electrostatically bonding a glass wafer to a semiconductor wafer, polishing the glass to a desired depth, masking the polished glass layer according to a desired pattern representative of the glass part, etching away all the glass except the desired pattern, and thence removing all the semiconductor.

摘要翻译： 通过利用包括至少一个静电键的一系列工艺形成玻璃或其它电介质的传感器结构。 这些工艺使得能够将半导体晶片与玻璃晶片的电介质接合。 然后通过选择性地去除某些导电半导体，获得固定到薄玻璃晶片的“薄带”压阻电桥。 所得到的结构完全是由现有技术无法预料的。