HYBRID LIQUID COOLING SYSTEM FOR ELECTRONICS

    公开(公告)号:US20250151228A1

    公开(公告)日:2025-05-08

    申请号:US18503702

    申请日:2023-11-07

    Inventor: Peng Cheng

    Abstract: Embodiments are disclosed of a hybrid liquid cooling apparatus. The apparatus includes a housing having a lid, a bottom, and at least one sidewall. The lid, the bottom, and the at least one sidewall form a sealed enclosure adapted to be at least partially filled with an immersion cooling fluid. A printed circuit board assembly (PCBA) positioned in the sealed enclosure. The PCBA includes one or more major electronic components and one or more minor electronic components. At least part of a cold plate is positioned in the sealed enclosure, is thermally coupled to the one or more major components, and is at least partially submerged in the immersion cooling fluid.

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