公开(公告)号：US20230062202A1

公开(公告)日：2023-03-02

申请号：US17825367

申请日：2022-05-26

Applicant: Apple Inc.

Inventor： Steven M Scardato ,  Baris Cagdaser ,  Patrick B Bennett ,  Michael Slootsky ,  Alejandro X Levander ,  Henry C Jen

IPC: G09G3/20

Abstract: An electronic device may have a display. The display may include an array of pixels formed on a silicon substrate. Display driver circuitry may be formed in a display driver integrated circuit that outputs display data and other control signals for operating the display. An interposer structure may be included in the electronic device. The interposer structure may be attached to the silicon display substrate and may only partially overlap the silicon display substrate. The display driver integrated circuit may be attached to the interposer structure and provide signals to the display pixels through the interposer structure. In another possible arrangement, the display driver integrated circuit may bridge a gap between the silicon display substrate and the flexible printed circuit. The display driver integrated circuit only partially overlaps the silicon display substrate in this arrangement.

公开(公告)号：US12112681B2

公开(公告)日：2024-10-08

申请号：US17825367

申请日：2022-05-26

Applicant: Apple Inc.

Inventor： Steven M Scardato ,  Baris Cagdaser ,  Patrick B Bennett ,  Michael Slootsky ,  Alejandro X Levander ,  Henry C Jen

IPC: G09G3/20

CPC classification number: G09G3/2092 ,  G09G2300/0408 ,  G09G2300/0426

Abstract: An electronic device may have a display. The display may include an array of pixels formed on a silicon substrate. Display driver circuitry may be formed in a display driver integrated circuit that outputs display data and other control signals for operating the display. An interposer structure may be included in the electronic device. The interposer structure may be attached to the silicon display substrate and may only partially overlap the silicon display substrate. The display driver integrated circuit may be attached to the interposer structure and provide signals to the display pixels through the interposer structure. In another possible arrangement, the display driver integrated circuit may bridge a gap between the silicon display substrate and the flexible printed circuit. The display driver integrated circuit only partially overlaps the silicon display substrate in this arrangement.