公开(公告)号：US11543864B2

公开(公告)日：2023-01-03

申请号：US16938766

申请日：2020-07-24

Applicant: Apple Inc.

Inventor： Stuart M. Nevill ,  Andreas Rousounelos ,  Kieran Poulain ,  Martial A. Rousseau ,  Daniel W. Corona ,  Alix V. McCabe ,  Michael S. Browne ,  Bao Liu

IPC: H04R1/02 ,  G06F1/16 ,  H04R7/20

Abstract: Systems of the present disclosure include an electronic device with a chassis and a speaker assembly. The speaker assembly can include a speaker support surrounding a speaker and coupled to the chassis via a spring element. The spring element can be monolithically formed with a main body of the speaker support and be configured to reduce transmission of vibrations from the speaker to the chassis. For example, the spring element can include an arm that extends within an opening of the main body to connect the main body to a fastener secured to the chassis. The spring element can be provided with features that facilitate wide distribution of loads and relative movement between the speaker assembly and the chassis.