公开(公告)号：US20140310943A1

公开(公告)日：2014-10-23

申请号：US14183253

申请日：2014-02-18

Applicant: Apple Inc.

Inventor： Fabio T. Campos ,  Keith J. Hendren ,  Laura M. DeForest ,  Michelle R. Goldberg ,  Kelsey J. MacMillan ,  Bryan J. Licata

IPC: B23P11/00 ,  B29C65/48

CPC classification number: B29C65/4825 ,  B23B31/14 ,  F16B11/006 ,  G06F1/1626 ,  Y10T29/49947 ,  Y10T29/4995 ,  Y10T29/49952 ,  Y10T29/49954 ,  Y10T29/53974 ,  Y10T279/24 ,  Y10T279/247

Abstract: The described embodiments relate generally to methods of assembly of electronic devices. In particular, a rotationally induced pressure is used to activate a securing mechanism positioned between a component and an enclosure. The component and the securing mechanism may be located in an inaccessible region of the enclosure such that traditional, direct, assembly processes may not be feasible. The securing mechanism may take the form of a layer of pressure sensitive adhesive or a fastener between the component and an interior surface of the enclosure.

Abstract translation: 所描述的实施例一般涉及电子设备的组装方法。 特别地，使用旋转感应压力来激活定位在部件和外壳之间的固定机构。 组件和固定机构可以位于外壳的不可接近的区域中，使得传统的，直接的组装过程可能不可行。 固定机构可以采取一种压敏粘合剂层或紧固件的形式在该组件和该外壳的内表面之间。

公开(公告)号：US10016933B2

公开(公告)日：2018-07-10

申请号：US14183253

申请日：2014-02-18

Applicant: Apple Inc.

Inventor： Fabio T. Campos ,  Keith J. Hendren ,  Laura M. DeForest ,  Michelle R. Goldberg ,  Kelsey J. MacMillan ,  Bryan J. Licata

IPC: B23B31/16 ,  B25B11/00 ,  F16B11/00 ,  G06F1/16 ,  B29C65/48 ,  B23B31/14

CPC classification number: B29C65/4825 ,  B23B31/14 ,  F16B11/006 ,  G06F1/1626 ,  Y10T29/49947 ,  Y10T29/4995 ,  Y10T29/49952 ,  Y10T29/49954 ,  Y10T29/53974 ,  Y10T279/24 ,  Y10T279/247

Abstract: The described embodiments relate generally to methods of assembly of electronic devices. In particular, a rotationally induced pressure is used to activate a securing mechanism positioned between a component and an enclosure. The component and the securing mechanism may be located in an inaccessible region of the enclosure such that traditional, direct, assembly processes may not be feasible. The securing mechanism may take the form of a layer of pressure sensitive adhesive or a fastener between the component and an interior surface of the enclosure.