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公开(公告)号：US20240397665A1
公开(公告)日：2024-11-28
申请号：US18202229
申请日：2023-05-25
Applicant: Apple Inc.
Inventor： Jifang TIAN , Anthony J. AIELLO , Arash NAGHIB LAHOUTI , Cheng P. TAN
IPC: H05K7/20
Abstract: A thermal module may include a valve used to promote unidirectional flow. The valve may be formed from several flow barriers designed to provide minimal resistance to a refrigerant while flowing in one direction, but provide significant resistance to flow in the opposite direction. The thermal module may include a void. The refrigerant may flow or circulate in a loop around the void. Using the valve for unidirectional flow, a thermal module may provide enhanced thermal transport capabilities.
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