SENSOR ASSEMBLY
    1.
    发明公开
    SENSOR ASSEMBLY 审中-公开

    公开(公告)号:US20240353440A1

    公开(公告)日:2024-10-24

    申请号:US18685492

    申请日:2022-08-24

    Applicant: Apple Inc.

    Abstract: A sensor assembly for a head-mountable device, the sensor assembly comprising: a flex circuit, an inertial measurement unit coupled to the flex circuit, an enclosure disposed around the inertial measurement unit and a portion of the flex circuit, to define a sealed volume containing the inertial measurement unit and the portion of the flex circuit. Thereby, a head-mountable device can securely support sensors in a manner that maintains their positions and orientations over time and isolates the sensors from an external environment. The sensor can be mounted within a sealed enclosure while maintaining an operable connection to the sensor. The sensor assemblies provides high robustness during the entirety of the service life of the head-mountable device without placing strain on the sensors themselves. The seal of the enclosure can isolate the sensor from external influences by preventing ingress of elements through the case and plate.

Patent Agency Ranking