公开(公告)号：US10521049B2

公开(公告)日：2019-12-31

申请号：US16144911

申请日：2018-09-27

Applicant: Apple Inc.

Inventor： David Sheldon Schultz ,  Prithu Sharma ,  Zachary M. Gaubert

IPC: G06F3/041 ,  G06F3/044

Abstract: The disclosure relates to a touch screen including a first electrode layer, a second electrode layer, and a third electrode layer. The touch screen can include shield-sensor vias connecting the first electrode layer and the second electrode layer and shield-shield vias connecting the first electrode layer and the third electrode layer, for example. The shield-sensor vias can be placed in a bond pad region of the touch screen, which can further include connections between one or more routing traces connected to one or more touch electrodes and touch or other circuitry further included in the electronic device. The shield-shield vias can be placed in an outer region located around an inner region of the touch screen. In some examples, one or more routing traces can include diverted portions to maintain a threshold distance between the routing traces and the one or more shield-shield vias.

公开(公告)号：US11119616B2

公开(公告)日：2021-09-14

申请号：US16661847

申请日：2019-10-23

Applicant: Apple Inc.

Inventor： Helia Rahmani ,  Prithu Sharma ,  David Sheldon Schultz

IPC: G06F3/044 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/09

Abstract: Trace transfer techniques can be used to couple touch electrodes to touch sensing circuitry with a reduced border region around a touch sensor panel. Touch electrodes on a first side of the substrate can be routed to a bond pad region on the second side of the substrate via a trace transfer technique to enable single-sided bonding of a double-sided touch sensor panel. Trace transfer techniques can also be used to couple conductive traces on a first side of the substrate to a flex circuit oriented perpendicular to or otherwise not parallel to the first side of the substrate. Orienting the flex circuit in this way can allow the flex circuit to connect to touch circuitry with reduced bending as compared with the amount of bending of the flex circuit when oriented substantially parallel to the substrate.