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公开(公告)号：US20240389285A1
公开(公告)日：2024-11-21
申请号：US18689837
申请日：2022-09-16
Applicant: Apple Inc.
Inventor： Laura M. CAMPO , Samuel A. RESNICK , Dragos MOROIANU , Sivesh SELVAKUMAR , Jason C. SAUERS , Phil M. HOBSON
Abstract: An electronic device is provided that includes a heatsink, an electrical circuit mounted on the heatsink, and a chassis. A plurality of heat-insulating connectors mounting the heatsink to the chassis at a first plurality of mount points, and a plurality of heat-conducting connectors mounting the heatsink to the chassis at a second plurality of mount points. The first plurality of mount points are located closer to the electrical circuit mounted on the heatsink than the second plurality of mount points.
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