ETCHING FOR BONDING POLYMER MATERIAL TO A METAL SURFACE

    公开(公告)号:US20190098785A1

    公开(公告)日:2019-03-28

    申请号:US16125409

    申请日:2018-09-07

    Applicant: Apple Inc.

    Abstract: This application relates to a composite part that can include a non-metal layer having attachment features, and a metal part that is joined with the non-metal layer. The metal part can include a plurality of interlocking structures that are disposed at an external surface of the metal part, where each of the interlocking structures can include an opening characterized as having a first width, and an undercut region, where the opening leads into the undercut region, and the undercut region is characterized as having a second width that is greater than the first width such that the undercut region captures and retains one of the attachment features of the non-metal layer.

Patent Agency Ranking